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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR THE FORMATION OF HYDROGEL
Document Type and Number:
WIPO Patent Application WO/2004/044024
Kind Code:
A1
Abstract:
A photosensitive resin composition comprising (A) a water-soluble photosensitive poly(meth)acrylic acid resin which is produced by addition reaction of part of the carboxyl groups of a (meth)acrylic acid polymer with a compound represented by the general formula (1) and has an acid number of solids of 150mgKOH/g or above, (B) a photopolymerization initiator, and (C) water: (1) wherein R1 is H or Me; and R2 is linear or branched alkylene having 2 to 10 carbon atoms.

Inventors:
UTSUNOMIYA SHIN (JP)
YAMADA SEIGO (JP)
TAKANO MASAHIRO (JP)
MIYAZAKI MITSUHARU (JP)
Application Number:
PCT/JP2003/014466
Publication Date:
May 27, 2004
Filing Date:
November 13, 2003
Export Citation:
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Assignee:
TOYO GOSEI CO LTD (JP)
UTSUNOMIYA SHIN (JP)
YAMADA SEIGO (JP)
TAKANO MASAHIRO (JP)
MIYAZAKI MITSUHARU (JP)
International Classes:
G03F7/027; C08F8/14; C08F265/02; C08F290/12; C08F299/00; C08L51/00; G03F7/038; (IPC1-7): C08F299/04
Foreign References:
JPH11327139A1999-11-26
JP2002214354A2002-07-31
JPH103167A1998-01-06
Other References:
See also references of EP 1564232A4
Attorney, Agent or Firm:
Kurihara, Hiroyuki (Iwasaki Bldg.7F 3-15 Hiroo 1-chom, Shibuya-ku Tokyo, JP)
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