Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, HOLLOW STRUCTURE, CURED MATERIAL, HOLLOW STRUCTURE PRODUCTION METHOD, ELECTRONIC COMPONENT, AND ELASTIC WAVE FILTER
Document Type and Number:
WIPO Patent Application WO/2021/100538
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition that is excellent in pattern-processability and pressure resistance, from which a highly reliable insulating film can be formed, and is applicable to the use for a substrate to which a high elastic modulus and a high resolution are required. A photosensitive resin composition contains a polymer (A), a glass filler (B), a photopolymerizable compound (C), a photoinitiator (D) and a thermal crosslinker (E), the glass filler (B) containing at least two selected from the group consisting of silicon oxide, aluminum oxide, and boron oxide, and the glass filler (B) further containing a rare earth oxide.
Inventors:
KAWANO TOMOTAKA (JP)
MATSUMOTO AKIKO (JP)
KANAMORI DAISUKE (JP)
KATSURADA YUKI (JP)
MATSUMOTO AKIKO (JP)
KANAMORI DAISUKE (JP)
KATSURADA YUKI (JP)
Application Number:
PCT/JP2020/041824
Publication Date:
May 27, 2021
Filing Date:
November 10, 2020
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08F283/04; C08F2/44; C08G73/10; G03F7/004; G03F7/037; H05K3/28
Foreign References:
| JP2013088740A | 2013-05-13 | |||
| JP2015118194A | 2015-06-25 |
Download PDF: