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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, TRANSFER FILM, CURED FILM, LAMINATE, AND METHOD FOR MANUFACTURING TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2021/014914
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition having exceptional properties for suppressing development residue and, after heat treatment of a resultant film or cured film, exceptional corrosion-resistance properties in bare wiring at the edges of the film; and a transfer film, a cured film, a laminate, and a method for manufacturing a touch panel in which the photosensitive resin composition is used. This photosensitive resin composition contains: a compound A having a heterocycle structure in which at least one selected from oxygen atoms, nitrogen atoms, and sulfur atoms is included within a ring structure, the compound A also having at least one functional group selected from the group consisting of -SH, -OH, -COOH, -NH2, and -CONH2; an alkali-soluble binder polymer; an ethylenic unsaturated compound; and a photopolymerization initiator.

Inventors:
ARITOSHI YOHEI (JP)
KODAMA KUNIHIKO (JP)
Application Number:
PCT/JP2020/025883
Publication Date:
January 28, 2021
Filing Date:
July 01, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B15/08; C08F12/08; C08F20/10; G03F7/004; G03F7/027; G03F7/032; G03F7/20; G06F3/041; G06F3/044; H05K3/28
Foreign References:
JP2018072789A2018-05-10
JP2017097320A2017-06-01
JP2018120652A2018-08-02
JP2014202895A2014-10-27
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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