Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO/2003/075095
Kind Code:
A1
Abstract:
A photosensitive resin composition suitable for use as a solder resist composition having satisfactory hydrolyzability; a photosensitive resin composition which photocures to give a cured film having excellent resistance to galvanic corrosion and thermal shock; and a photosensitive resin composition suitable for use as a solder resist composition having high sensitivity and satisfactory solvent resistance. The photosensitive resin compositions are characterized by comprising: (A) a polyester (meth)acrylate obtained by subjecting (meth)acrylic acid to dehydrating condensation and esterification with a polyester polyol obtained by the polycondensation of (a) a dihydric alcohol with (b) a dibasic acid; (B) a carboxylated photosensitive resin; and (C) a photoinitiator.

Inventors:
KATAGI HIDEYUKI (JP)
YOSHINO TOSHIZUMI (JP)
KURISAKI YASUYUKI (JP)
KONDOU HIDEKAZU (JP)
JOUMEN MASAYOSHI (JP)
SATOU KUNIAKI (JP)
HIRAYAMA TAKAO (JP)
Application Number:
PCT/JP2003/002663
Publication Date:
September 12, 2003
Filing Date:
March 06, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KATAGI HIDEYUKI (JP)
YOSHINO TOSHIZUMI (JP)
KURISAKI YASUYUKI (JP)
KONDOU HIDEKAZU (JP)
JOUMEN MASAYOSHI (JP)
SATOU KUNIAKI (JP)
HIRAYAMA TAKAO (JP)
International Classes:
G03F7/027; H05K3/28; (IPC1-7): G03F7/027; G03F7/032
Foreign References:
JPH0912654A1997-01-14
JP2002023363A2002-01-23
EP0919873A11999-06-02
JPH11288087A1999-10-19
Attorney, Agent or Firm:
Miyoshi, Hidekazu (2-8 Toranomon 1-chome, Minato-k, Tokyo 01, JP)
Download PDF: