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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRING PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/075005
Kind Code:
A1
Abstract:
The present invention pertains to a photosensitive resin film that contains a binder polymer, a photo-polymerizable compound, a photoinitiator, and a polymerization inhibitor, and that has a thickness of 35-300 μm.

Inventors:
ARAI TATSUHIKO (JP)
HIRAYAMA FUUKA (JP)
ONO KEISHI (JP)
NARITA MAO (JP)
FUKAYA TAKAHIRO (JP)
Application Number:
PCT/JP2019/040754
Publication Date:
April 22, 2021
Filing Date:
October 16, 2019
Export Citation:
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Assignee:
SHOWA DENKO MAT CO LTD (JP)
International Classes:
G03F7/40; G03F7/004; G03F7/027; G03F7/42
Domestic Patent References:
WO2018173840A12018-09-27
WO2013172302A12013-11-21
Foreign References:
JP2005309273A2005-11-04
JP2006251386A2006-09-21
JP2009020191A2009-01-29
JP2002372781A2002-12-26
JP2013200328A2013-10-03
JP2012215676A2012-11-08
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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