Title:
PHOTOSENSITIVE RESIN LAYER, AND DRY FILM PHOTORESIST AND PHOTOSENSITIVE ELEMENT USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/137466
Kind Code:
A1
Abstract:
The present invention relates to a photosensitive resin layer, and dry film photoresist and photosensitive element using the photosensitive resin layer, the photosensitive resin layer comprising: a photo-polymerization compound containing a multi-functional (meth)acrylate compound of three or more functions; and alkali development-type binder resin, wherein the change in the color coordinate value (b*) over time, calculated according to equation 1, satisfies a particular range in the photosensitive resin layer.
Inventors:
SHIM SANG HWA (KR)
Application Number:
PCT/KR2020/018143
Publication Date:
July 08, 2021
Filing Date:
December 11, 2020
Export Citation:
Assignee:
KOLON INC (KR)
International Classes:
G03F7/004; C08F212/08; C08F220/06; C08F220/18; C08F220/28; C08F220/36; C08F265/06; G03F7/028; G03F7/033; G03F7/09
Foreign References:
| JP2013037272A | 2013-02-21 | |||
| JPH11316456A | 1999-11-16 | |||
| US20090263746A1 | 2009-10-22 | |||
| KR20100039275A | 2010-04-15 | |||
| KR102177310B1 | 2020-11-10 | |||
| KR102177311B1 | 2020-11-11 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (KR)
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