PHOTOSENSITIVE RESIN AND PHOTORESIST COMPOSITION USING SAME - NINGBO NATA OPTO ELECTRONIC MAT CO LTD

Title:

PHOTOSENSITIVE RESIN AND PHOTORESIST COMPOSITION USING SAME

Document Type and Number:

WIPO Patent Application WO/2022/056700

Kind Code:

A1

Abstract:

A photosensitive resin and a photoresist composition using same. The photosensitive resin comprises resin-type photosensitive anions and sulfonium salt cations, wherein in the structural formula of the resin-type photosensitive anion, R1 and R2 are H or methyl; R3 is a modified structure; R4, R5, and R6 are one or more of alkyl, aryl or a sulfur/oxygen/nitrogen heteroatom-containing substituent in which the number of hydrogen atoms is an integer between 1 and 40 and the number of carbon atoms is an integer between 1 and 20; n is an integer between 2 and 200, and R7 is one or more of alkyl, aryl or a sulfur/oxygen/nitrogen heteroatom-containing functional structure. The photosensitive resin is applied to the photoresist composition to improve the film forming capability of the photoresist composition, improve a photolithographic pattern, improve photoresist resolution, and reduce line width roughness, such that the photoresist composition can be applied to photolithography of large scale integrated circuits.

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Inventors:

GU DAGONG (CN)
YU SHAOSHAN (CN)
QI GUOQIANG (CN)
MAO ZHIBIAO (CN)
XU CONGYING (CN)
XU DONGSHENG (CN)
FANG TAO (CN)
CHEN LING (CN)

Application Number:

PCT/CN2020/115465

Publication Date:

March 24, 2022

Filing Date:

September 16, 2020

Export Citation:

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Assignee:

NINGBO NATA OPTO ELECTRONIC MAT CO LTD (CN)
JIANGSU NATA OPTO ELECT MAT CO LTD (CN)

International Classes:

C07C321/30; C07C303/32; C07C309/04; C07C319/20; G03F7/004

Domestic Patent References:

WO2013024756A1

2013-02-21

Foreign References:

US20110183263A1	2011-07-28
JP2012073398A	2012-04-12
CN102603579A	2012-07-25

Attorney, Agent or Firm:

GLAMORAL INTELLECTUAL PROPERTY AGENCY. CO. (CN)

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