Title:
PHOTOSENSITIVE RESINS, RESIN COMPOSITIONS AND PRODUCTS OF CURING THEREOF
Document Type and Number:
WIPO Patent Application WO/2003/072634
Kind Code:
A1
Abstract:
A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono- anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.
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Inventors:
KOYANAGI HIROO (JP)
NAKAYAMA KOJI (JP)
UMEYAMA CHIE (JP)
KAWADA YOSHIHIRO (JP)
YOKOSHIMA MINORU (JP)
NAKAYAMA KOJI (JP)
UMEYAMA CHIE (JP)
KAWADA YOSHIHIRO (JP)
YOKOSHIMA MINORU (JP)
Application Number:
PCT/JP2003/002081
Publication Date:
September 04, 2003
Filing Date:
February 25, 2003
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
KOYANAGI HIROO (JP)
NAKAYAMA KOJI (JP)
UMEYAMA CHIE (JP)
KAWADA YOSHIHIRO (JP)
YOKOSHIMA MINORU (JP)
KOYANAGI HIROO (JP)
NAKAYAMA KOJI (JP)
UMEYAMA CHIE (JP)
KAWADA YOSHIHIRO (JP)
YOKOSHIMA MINORU (JP)
International Classes:
C08F290/06; C08G63/20; C08G63/668; C08G63/91; C08L67/06; C08L67/07; C09D167/07; G02B6/138; (IPC1-7): C08G63/91; C08F290/06; C08L67/06; G02B6/12; G02B6/122
Foreign References:
| JP2002138140A | 2002-05-14 | |||
| JP2001051415A | 2001-02-23 |
Attorney, Agent or Firm:
Saeki, Norio (Taka-ai Building 15-2, Nihonbashi 3-chom, Chuo-ku Tokyo, JP)
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