PHOTOSENSITIVE SILICONE RESIN COMPOSITION - ASAHI KASEI E MATERIALS CORP

Title:

PHOTOSENSITIVE SILICONE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2012/020599

Kind Code:

A1

Abstract:

Provided is a resin composition which gives a cured product of a photocurable resin having good crack resistance even when formed into a thick film, and capable of maintaining a low coefficient of linear expansion, low thermal weight loss, and a low shrinkage factor. This photosensitive silicone resin composition comprises (A) a silica particle-containing condensation reaction product and (B) a photopolymerization initiator, and is characterized in that the silica particle-containing condensation reaction product (A) is a condensation reaction product of a polysiloxane compound (a) comprising a hydrolytic condensation product of one or more silane compounds represented by the following general formula (1): R1 n1SiX1 4-n1 (wherein R1, n1, and X1 are defined in the claims) and/or the silane compound, and silica particles (b), and has a terminal structure: Si-O-Y (wherein Y is defined in the claims) which satisfies the following formula (2): 0 < [Si-O-SiR3 3] / ([Si-O-R2] + [Si-O-SiR3 3]) ≤ 1 (wherein R2 and R3 are defined in the claims), and has a photopolymerizable functional group.

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Inventors:

TSUGANE NATSUMI (JP)
SAITO HIDEO (JP)
KUSAKABE TORU (JP)
NAKAMICHI MOTONORI (JP)

Application Number:

PCT/JP2011/063727

Publication Date:

February 16, 2012

Filing Date:

June 15, 2011

Export Citation:

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Assignee:

ASAHI KASEI E MATERIALS CORP (JP)
TSUGANE NATSUMI (JP)
SAITO HIDEO (JP)
KUSAKABE TORU (JP)
NAKAMICHI MOTONORI (JP)

International Classes:

C08G77/20; C08F299/08; C08G77/14; C08L83/06; C08L83/07; G03F7/075

Domestic Patent References:

WO2006035646A1

2006-04-06

Foreign References:

JP2005298796A	2005-10-27
JP4352847B2	2009-10-28
JP2851915B2	1999-01-27
JPH0372193B2	1991-11-15
JP2009102628A	2009-05-14
JP4352847B2	2009-10-28

Other References: