Title:
PHOTOSENSITIVE TRANSFER MATERIAL, RESIN PATTERN MANUFACTURING METHOD, CIRCUIT WIRING MANUFACTURING METHOD, AND TOUCH PANEL MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/163301
Kind Code:
A1
Abstract:
Provided are: a photosensitive transfer material having a temporary support and a photosensitive resin layer containing an alkali-soluble resin, an ethylenically unsaturated compound, and a photopolymerization initiator, wherein when the photosensitive resin layer is exposed at an exposure amount Ep in a unit of mJ/cm2, W+ is a double bond reaction region width after exposing a line-and-space pattern of 10 μm/10 μm at an exposure amount corresponding to Ep+10%, and W- is a double bond reaction region width after exposing a line-and-space pattern of 10 μm/10 μm at an exposure amount corresponding to Ep-10%, the value of the difference (W+)-(W-) between the double bond reaction region widths is at most 1.45 μm; and a resin pattern manufacturing method, a circuit wiring manufacturing method, and a touch panel manufacturing method which use said photosensitive transfer material.
Inventors:
ARIDOMI TAKASHI (JP)
NITTA KOJI (JP)
MOCHIZUKI HIDEHIRO (JP)
NITTA KOJI (JP)
MOCHIZUKI HIDEHIRO (JP)
Application Number:
PCT/JP2021/048963
Publication Date:
August 04, 2022
Filing Date:
December 28, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/031; G03F7/032; G03F7/20; G06F3/041
Domestic Patent References:
| WO2017033868A1 | 2017-03-02 |
Foreign References:
| JP2013218313A | 2013-10-24 | |||
| JP2019168624A | 2019-10-03 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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