Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PIEZOELECTRIC VIBRATION DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/075124
Kind Code:
A1
Abstract:
In this invention, a first and second mounting terminals, which are connected to metal films for the first and second mounting terminals formed on both end portions of a piezoelectric vibration plate that sandwich a vibration part, are each formed on the outer surface of a film bonded to the piezoelectric vibration plate. Consequently, even if the sizes of the metal films for the first and second mounting terminals on both sides of the vibration part are reduced in order to enlarge the vibration part, it is possible to secure a bonding region for mounting of each of the first and second mounting terminals formed on the outer surface of a resin film.

More Like This:
JP7445957Sonic device and its manufacturing method
JP3983226Wafer Level Package FBAR Element Manufacturing Method
JPH1041771MANUFACTURE OF VIBRATOR AND MANUFACTURE DEVICE THEREFOR
Inventors:
OHNISHI MANABU (JP)
Application Number:
PCT/JP2020/029024
Publication Date:
April 22, 2021
Filing Date:
July 29, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAISHINKU CORP (JP)
International Classes:
H03H3/02; H03H9/02; H03H9/19
Foreign References:
JP2008205761A2008-09-04
JP2014030126A2014-02-13
JPH11136076A1999-05-21
JP2018032944A2018-03-01
JP2011082870A2011-04-21
JP2012195630A2012-10-11
JP2017212509A2017-11-30
JPH0998049A1997-04-08
JP2000103010A2000-04-11
JP2006339661A2006-12-14
JP2010187054A2010-08-26
Attorney, Agent or Firm:
OKADA Kazuhide (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: SEWING METHOD AND DEVICE FOR SAME

Next Patent: MOLDED ARTICLE, ELECTRICAL PRODUCT AND METHOD FOR PRODUCING MOLDED ARTICLE