PIN TERMINAL, CONNECTOR, CONNECTOR-EQUIPPED WIRE HARNESS, AND CONTROL UNIT

WIPO Patent Application WO/2021/054108

A1

This pin terminal is provided with a rod-like substrate and a plating layer that covers a prescribed region of the substrate, wherein: the substrate is composed of a material that is either pure copper or a copper alloy; the plating layer is provided with a tin-based layer composed of a metal that contains tin; the substrate has, to one end side thereof, a tip-covering part that covers the entire circumferential region of the substrate; the tin-based layer includes the tip-covering part; the tip-covering part is provided with a thin-film portion and a thick-film portion that are located at different positions of the substrate in the circumferential direction; the thin-film portion is provided with an outer layer and an inner layer that is provided in contact with the substrate; the outer layer is composed of a material that is pure tin; the inner layer is composed of a material that is an alloy containing tin and copper; the outer layer has a thickness of 0.5 μm or more; and the inner layer has a thickness of 0.1 μm or more.

KAMAMOTO MICHITAKE (JP)
KATO AKIHIRO (JP)
KUMONDAI MITSUHIRO (JP)
SAKA YOSHIFUMI (JP)

PCT/JP2020/032932

March 25, 2021

August 31, 2020

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AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

C25D5/02; C25D5/10; C25D5/12; C25D5/50; C25D7/00; H01B5/02; H01B7/00; H01R13/03

WO2018221087A1

2018-12-06

JP2019057447A	2019-04-11
JP2018090875A	2018-06-14
JP2015210942A	2015-11-24
JP2005154835A	2005-06-16
JP2005206942A	2005-08-04
JP2014191998A	2014-10-06

YAMANO Hiroshi et al. (JP)

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