Title:
PLATED LAMINATE AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/101183
Kind Code:
A1
Abstract:
The present invention relates to a plating laminating technique for providing an inner layer of a printed circuit board having improved adhesive force, and has an effect of providing: an electrolessly plated laminate including a non-etching/low luminance laminated pre-treatment body or low luminance copper foil; and a printed circuit board comprising same.
Inventors:
CHUN SUNG WOOK (KR)
CHUNG BO MOOK (KR)
PARK MYONG WHAN (KR)
CHUNG BO MOOK (KR)
PARK MYONG WHAN (KR)
Application Number:
PCT/KR2019/013407
Publication Date:
May 22, 2020
Filing Date:
October 14, 2019
Export Citation:
Assignee:
YMT CO LTD (KR)
International Classes:
C23C18/16; C23C18/18; C23C18/38; H05K1/09; H05K3/18
Foreign References:
| JP2002030452A | 2002-01-31 | |||
| JP2001348669A | 2001-12-18 | |||
| KR20160116288A | 2016-10-07 | |||
| JPH06158336A | 1994-06-07 | |||
| KR101468074B1 | 2014-12-02 | |||
| KR101108991B1 | 2012-01-31 |
Other References:
See also references of EP 3760761A4
Attorney, Agent or Firm:
LEE, Sung Ha (KR)
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