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Patent Searching and Data


Title:
POLISHING APPARATUS AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/039401
Kind Code:
A1
Abstract:
The present invention relates to a polishing apparatus and a polishing method, whereby a substrate is polished while a film thickness of the substrate is measured by analyzing reflected light from the substrate on a polishing pad. The polishing apparatus is provided with: a polishing table (3) supporting a polishing pad (2) with a through hole (61); a pad height measuring device (32) that measures the height of a polishing surface (2a); a pure water supply line (63) and a pure water suction line (64) connected to the through hole (61); a flow rate adjustment device (71) connected to the pure water supply line (63); and an operation control unit (35) that controls operation of the flow rate adjustment device (71). The operation control unit (35) determines from correlation data a flow rate of pure water corresponding to a measured value of the height of the polishing surface (2a), and controls operation of the flow rate adjustment device (71) such that the pure water flows through the pure water supply line (63) at the flow rate thus determined.

Inventors:
TAKAHASHI NOBUYUKI (JP)
KINOSHITA MASAKI (JP)
Application Number:
PCT/JP2020/030688
Publication Date:
March 04, 2021
Filing Date:
August 12, 2020
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B37/013; B24B49/04; B24B49/12; H01L21/304
Foreign References:
JP2006525878A2006-11-16
JP2001088021A2001-04-03
JP2019024034A2019-02-14
JP2019024036A2019-02-14
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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