Title:
POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO1999026763
Kind Code:
A3
Abstract:
A polishing apparatus has two parallel processing lines that enables to carry out efficient parallel processing by minimizing the idle time for the turntable and maximizing the through-put. The polishing apparatus comprises at least two processing lines extending in parallel from a storage section. Each line is provided with a cleaning unit (18a, 18b) and a polishing unit (10a, 10b), a temporary storage station (20) disposed between the cleaning unit (18a, 18b) and the polishing unit (10a, 10b) and shared by the processing lines. At least two robotic devices (22, 24) are disposed on each of the processing lines for transferring workpieces among the temporary storage station (20), the polishing unit (10a, 10b) and the cleaning unit (18a, 18b).
Inventors:
KATSUOKA SEIJI (JP)
TSUJIMURA MANABU (JP)
SAKURAI KUNIHIKO (JP)
OSAWA HIROYUKI (JP)
TSUJIMURA MANABU (JP)
SAKURAI KUNIHIKO (JP)
OSAWA HIROYUKI (JP)
Application Number:
PCT/JP1998/005252
Publication Date:
September 02, 1999
Filing Date:
November 20, 1998
Export Citation:
Assignee:
EBARA CORP (JP)
KATSUOKA SEIJI (JP)
TSUJIMURA MANABU (JP)
SAKURAI KUNIHIKO (JP)
OSAWA HIROYUKI (JP)
KATSUOKA SEIJI (JP)
TSUJIMURA MANABU (JP)
SAKURAI KUNIHIKO (JP)
OSAWA HIROYUKI (JP)
International Classes:
B24B37/04; B24B1/00; B24B27/00; B24B37/10; B24B37/11; B24B37/27; B24B37/34; B24B49/12; B24B53/007; B24B53/017; (IPC1-7): B24B37/04
Foreign References:
| EP0761387A1 | 1997-03-12 | |||
| EP0807492A2 | 1997-11-19 | |||
| US5554064A | 1996-09-10 | |||
| US5542874A | 1996-08-06 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 096, no. 008 30 August 1996 (1996-08-30)
PATENT ABSTRACTS OF JAPAN vol. 095, no. 008 29 September 1995 (1995-09-29)
PATENT ABSTRACTS OF JAPAN vol. 098, no. 001 30 January 1998 (1998-01-30)
PATENT ABSTRACTS OF JAPAN vol. 095, no. 008 29 September 1995 (1995-09-29)
PATENT ABSTRACTS OF JAPAN vol. 098, no. 001 30 January 1998 (1998-01-30)
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