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Title:
POLISHING COMPOSITION, POLISHING COMPOSITION MANUFACTURING METHOD AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/210744
Kind Code:
A1
Abstract:
[Problem] To provide a polishing composition that has a superior working force and that has good washability after polishing. [Solution] A polishing composition including: abrasive grains; water; and a hydrophobic dispersion medium. The hydrophobic dispersion medium includes at least one type selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthene hydrocarbons, and terpene hydrocarbons. The polishing composition has a flash point of 30-100℃ or a vapor pressure at 20℃ of 0.004-2 kPa or less.

Inventors:
TENKO KYOSUKE (JP)
ITO JUN (JP)
YASUI DAISUKE (JP)
MORINAGA HITOSHI (JP)
Application Number:
PCT/JP2022/015601
Publication Date:
October 06, 2022
Filing Date:
March 29, 2022
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00
Domestic Patent References:
WO2019066014A12019-04-04
Foreign References:
JP2004359831A2004-12-24
JP2004025323A2004-01-29
JPH08503233A1996-04-09
JP2000282011A2000-10-10
JP2006056996A2006-03-02
JPH02269791A1990-11-05
JP2012251099A2012-12-20
JP2021059448A2021-04-15
Other References:
HYDROCARBON PROCESSING PETROLEUM REFINER, vol. 42, no. 6, June 1963 (1963-06-01)
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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