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Title:
POLISHING COMPOSITION AND METHOD FOR POLISHING SYNTHETIC RESIN
Document Type and Number:
WIPO Patent Application WO/2020/122191
Kind Code:
A1
Abstract:
Provided are: a polishing composition which can be used more suitably in a use application in which a synthetic resin or the like is polished; and a polishing method for polishing an object of interest with a polishing composition. A polishing composition is provided, which contains abrasive grains, 0.01 to 15% by mass of an aluminum salt of a monovalent acid, a pyrrolidone compound or a caprolactam compound, and water, and has a pH value of 7.0 or less.

Inventors:
ISHIDA HIROYUKI (JP)
WAKABAYASHI RYO (JP)
Application Number:
PCT/JP2019/048762
Publication Date:
June 18, 2020
Filing Date:
December 12, 2019
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09G1/02; B24B37/00; C09K3/14
Foreign References:
JP2008537704A2008-09-25
CN102516882A2012-06-27
CN108188863A2018-06-22
JP2018533071A2018-11-08
JP2001342456A2001-12-14
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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