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Patent Searching and Data


Title:
POLISHING COMPOSITION AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/181693
Kind Code:
A1
Abstract:
[Problem] To provide a polishing composition capable of polishing a silicon oxide carbide (SiOC) at a faster rate than the rate of polishing the silicon nitride (that is, having a high SiOC/silicon nitride selectivity). [Solution] This polishing composition contains konpeito-like silica particles and a dispersion medium and has a pH of less than 5.

Inventors:
TSENG TZU-CHUN (TW)
Application Number:
PCT/JP2019/010307
Publication Date:
September 26, 2019
Filing Date:
March 13, 2019
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2016067923A12016-05-06
Foreign References:
JP2013080752A2013-05-02
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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