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Title:
POLISHING COMPOSITION AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/051659
Kind Code:
A1
Abstract:
For the polishing of polysilicon-containing substrates, provided are a polishing composition and a polishing method capable of suppressing the rate of polishing polysilicon and selectively polishing silicon compounds other than polysilicon, particularly silicon nitride. A polishing composition containing abrasive grains, an organic acid, and a conjugate base of the organic acid is used as the polishing composition.

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Inventors:
ISHIDA YASUTO (TW)
Application Number:
PCT/JP2015/004378
Publication Date:
April 07, 2016
Filing Date:
August 28, 2015
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Foreign References:
JP2005034986A2005-02-10
JP2005014204A2005-01-20
JP2005023313A2005-01-27
JP2001131535A2001-05-15
JP2002020732A2002-01-23
JP2009227893A2009-10-08
JP2007168034A2007-07-05
JP2007103457A2007-04-19
CN102358824A2012-02-22
JP2015137297A2015-07-30
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
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