Title:
POLISHING COMPOSITION AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/123875
Kind Code:
A1
Abstract:
The present invention provides: a means for preventing sedimentation of abrasive grains while maintaining polishing performance; and a means for improving re-dispersibility of abrasive grains while maintaining polishing performance. The present invention pertains to a polishing composition which is used for polishing a semiconductor substrate and which comprises abrasive grains, a lamellar compound, and a dispersion medium.
Inventors:
ISHIBASHI TOMOAKI (JP)
KON HIROKI (JP)
KON HIROKI (JP)
Application Number:
PCT/JP2017/046154
Publication Date:
July 05, 2018
Filing Date:
December 22, 2017
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2017187749A1 | 2017-11-02 |
Foreign References:
| JP2008502776A | 2008-01-31 | |||
| JP2002110596A | 2002-04-12 | |||
| JP2011110656A | 2011-06-09 | |||
| JP2004336082A | 2004-11-25 | |||
| JP2015165001A | 2015-09-17 | |||
| JP2012248569A | 2012-12-13 | |||
| JP2016251609A | 2016-12-26 |
Other References:
See also references of EP 3561858A4
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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