Title:
POLISHING COMPOSITION AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/180153
Kind Code:
A1
Abstract:
The present invention provides a polishing composition whereby it becomes possible to provide a silicon wafer that is reduced in the occurrence of edge roll off and is improved in the overall flatness when the silicon wafer is roughly polished. The present invention is a polishing composition which can be used for the rough polishing of a silicon wafer, said polishing composition comprising abrasive grains, a water-soluble polymer, a basic compound and water, wherein the water-soluble polymer comprises at least two types of water-soluble polymers that are different in silicon etching retardation ability from each other.
Inventors:
TSUCHIYA KOHSUKE (JP)
TANIGUCHI MEGUMI (JP)
NUMATA KEISUKE (JP)
TANIGUCHI MEGUMI (JP)
NUMATA KEISUKE (JP)
Application Number:
PCT/JP2018/007546
Publication Date:
October 04, 2018
Filing Date:
February 28, 2018
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2013108777A1 | 2013-07-25 | |||
| WO2013137212A1 | 2013-09-19 |
Foreign References:
| JP2015067774A | 2015-04-13 | |||
| JP2013165173A | 2013-08-22 | |||
| US20150014579A1 | 2015-01-15 | |||
| JP2017067956A | 2017-04-06 |
Other References:
See also references of EP 3605589A4
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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