Title:
POLISHING COMPOSITION AND USE THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/065022
Kind Code:
A1
Abstract:
Provided is a polishing composition capable of reducing post-polishing haze on the surface of a substrate. This polishing composition contains abrasive grains, a basic compound, water, and a compound represented by formula (I). R1, R2, R3, and R4 in formula (I) are respectively independently hydrogen, an alkyl group, a hydroxyl group, and a group selected from the group consisting of hydroxyalkyl groups. If the hydroxyl group does not exist in formula (I), the total number of carbon atoms in R1, R2, R3, and R4 is 1 or more.
Inventors:
GOTO OSAMU (JP)
TSUCHIYA KOHSUKE (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2021/032805
Publication Date:
March 31, 2022
Filing Date:
September 07, 2021
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09G1/02; B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
| WO2018131341A1 | 2018-07-19 |
Foreign References:
| JP2019119782A | 2019-07-22 | |||
| JP2017025231A | 2017-02-02 | |||
| JP2018532828A | 2018-11-08 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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