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Title:
POLISHING COMPOSITION USING POLISHING PARTICLES THAT HAVE HIGH WATER AFFINITY
Document Type and Number:
WIPO Patent Application WO/2020/091000
Kind Code:
A1
Abstract:
[Problem] To provide a polish composition having a high polishing rate and capable of suppressing the occurrence of defects, when used for CMP polishing for a device wafer. [Solution] This polishing composition includes silica particles, wherein the silica particles are based on a colloidal silica dispersion, and the measured value of pulsed NMR of the dispersion, Rsp=(Rav-Rb)/(Rb), is 0.15-0.7, and the shape factor, SF1 = (area of a circle, derived by using the maximum particle diameter of the particles as the diameter of the circle)/(projected area), of the silica particles, is 1.20-1.80. Rsp is an index indicating water affinity, Rav is the reciprocal of the relaxation time of the colloidal silica dispersion, and Rb is the reciprocal of the relaxation time of the blank aqueous solution excluding the silica particles in the colloidal silica dispersion. The colloidal silica dispersion has an average particle diameter of 40-200 nm as measured by a dynamic light scattering method, and the silica particles in the dispersion have an average primary particle diameter of 10-80 nm as measured by a nitrogen gas adsorption method.

Inventors:
MITSUI SHIGERU (JP)
NISHIMURA TOHRU (JP)
ISHIMIZU EIICHIRO (JP)
Application Number:
PCT/JP2019/042889
Publication Date:
May 07, 2020
Filing Date:
October 31, 2019
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
WO2018124229A12018-07-05
WO2018116890A12018-06-28
WO2018012174A12018-01-18
WO2018116890A12018-06-28
WO2015152151A12015-10-08
WO2018012174A12018-01-18
Foreign References:
JP2018104690A2018-07-05
JP2017117894A2017-06-29
JP2009131947A2009-06-18
JP2018002883A2018-01-11
JP2002338951A2002-11-27
JP2017117894A2017-06-29
Other References:
See also references of EP 3876264A4
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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