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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/065357
Kind Code:
A1
Abstract:
Provided is a polishing composition having excellent capability for removing protrusions at the hard laser mark periphery. This polishing composition contains abrasive grains, a basic compound, and water. The basic compound includes a combination of two or more types of quaternary ammonium compounds. The two or more types of quaternary ammonium compounds include tetramethyl ammonium hydroxide and one or more types selected from compounds represented by general formula (1). (In the formula, X- is a monovalent anion and R1, R2, R3, and R4 are each independently selected from the group consisting of C1-4 hydrocarbon groups. However, at least one of R1, R2, R3 and R4 is a C2-4 hydrocarbon group.)

Inventors:
TANIGUCHI MEGUMI (JP)
MUKAI TAKATOSHI (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2018/034401
Publication Date:
April 04, 2019
Filing Date:
September 18, 2018
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2015005433A12015-01-15
Foreign References:
JP2014509073A2014-04-10
JP2004511900A2004-04-15
JP2017132944A2017-08-03
JP2015233031A2015-12-24
Attorney, Agent or Firm:
ABE, Makoto (JP)
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