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Patent Searching and Data


Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/065994
Kind Code:
A1
Abstract:
Provided is a polishing composition which is capable of achieving a good balance between high polishing rate and good surface quality. The present invention provides a polishing composition for polishing a polishing object material. This polishing composition contains sodium metavanadate, hydrogen peroxide and silica abrasive grains. The content C1 of the sodium metavanadate is from 0.7% by weight to 3.5% by weight; the content C2 of the hydrogen peroxide is from 0.3% by weight to 3% by weight; and the content C3 of the silica abrasive grains is from 12% by weight to 50% by weight.

Inventors:
KON HIROKI (JP)
NOGUCHI NAOTO (JP)
Application Number:
PCT/JP2018/036320
Publication Date:
April 04, 2019
Filing Date:
September 28, 2018
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
WO2016072370A12016-05-12
Foreign References:
JP2010023198A2010-02-04
JP2010023199A2010-02-04
JP5095228B22012-12-12
Attorney, Agent or Firm:
ABE, Makoto (JP)
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