Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/198622
Kind Code:
A1
Abstract:
[Problem] To provide a polishing composition which can polish a substrate on which is formed a silica coating or the like at high speed by increasing the effects of mechanical friction using abrasive grains that produce no defects, which can simultaneously achieve high surface accuracy such as having low scratching and which can also be suitably used for a semiconductor substrate. [Solution] The polishing composition is characterized by the inclusion of a dispersion medium, abrasive grains, and at least one type of component selected from I) a phosphate-esterified microfibril cellulose, and II) a microfibril cellulose and a phosphate compound.
Inventors:
KOMATSU MICHIO (JP)
NISHIDA HIROYASU (JP)
TAWARAZAKO YUJI (JP)
NAKAYAMA KAZUHIRO (JP)
NISHIDA HIROYASU (JP)
TAWARAZAKO YUJI (JP)
NAKAYAMA KAZUHIRO (JP)
Application Number:
PCT/JP2019/015060
Publication Date:
October 17, 2019
Filing Date:
April 05, 2019
Export Citation:
Assignee:
JGC CATALYSTS & CHEMICALS LTD (JP)
International Classes:
C09K3/14; B24B37/00; C01B33/149; C01B33/18; C09G1/02; H01L21/304
Domestic Patent References:
| WO2012090510A1 | 2012-07-05 | |||
| WO2002031079A1 | 2002-04-18 |
Foreign References:
| JP2009065041A | 2009-03-26 | |||
| JP2001049031A | 2001-02-20 | |||
| JP2019026822A | 2019-02-21 |
Attorney, Agent or Firm:
TAKATSU Kazuya (JP)
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