POLISHING COMPOSITION - SUMITOMO SEIKA CHEMICALS

Title:

POLISHING COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2020/009054

Kind Code:

A1

Abstract:

The present invention provides a polishing means which is capable of improving the flatness of a substrate without significantly reducing the polishing rate. The present invention specifically provides a polishing composition which contains inorganic particles, water and a modified polyalkylene oxide that is represented by formula (1). (In the formula, each R1 independently represents a group represented by R11-(O-R12)x-; each R11 independently represents an alkyl group having 1-24 carbon atoms; each R12 independently represents an alkylene group having 2-4 carbon atoms; x represents an integer of 0-500; each R2 independently represents a hydrocarbon group; each R3 independently represents an alkylene group having 2-4 carbon atoms; n represents an integer of 1-1,000; and m represents an integer of 1 or more.)

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Inventors:

MASUDA TSUYOSHI (JP)
NISHIGUCHI HIDEAKI (JP)

Application Number:

PCT/JP2019/026040

Publication Date:

January 09, 2020

Filing Date:

July 01, 2019

Export Citation:

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Assignee:

SUMITOMO SEIKA CHEMICALS (JP)

International Classes:

C09K3/14; B24B37/00; C09G1/02; H01L21/304

Domestic Patent References:

WO2014007366A1	2014-01-09
WO2014007366A1	2014-01-09

Foreign References:

JP2013541194A	2013-11-07
JP2013140984A	2013-07-18
JP2003342556A	2003-12-03

Other References: