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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/027260
Kind Code:
A1
Abstract:
Provided is a polishing composition capable of quickly removing an oxide film even at a low abrasive grain concentration. This polishing composition contains a silica having a silanol group density of 2.0 OH/nm2 or more, and an organic silicon compound having, at an end thereof, an amino group, methyl amino group, dimethyl amino group, or quaternary ammonium group, wherein the organic silicon compound has two or more alkoxyl groups or hydroxyl groups bonded to a Si atom thereof. Note that the quaternary ammonium group of the organic silicon compound does not have an alkyl group having two or more carbon atoms.

Inventors:
MATSUDA SHUHEI (JP)
Application Number:
PCT/JP2019/030215
Publication Date:
February 06, 2020
Filing Date:
August 01, 2019
Export Citation:
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Assignee:
NITTA HAAS INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304; C07F7/18
Foreign References:
JP2015077681A2015-04-23
JP2003243340A2003-08-29
Attorney, Agent or Firm:
UEBA Hidetoshi et al. (JP)
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