Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/100563
Kind Code:
A1
Abstract:
Provided is a silicon wafer pre-polishing composition that has an exceptional ability to eliminate bulging of an HLM margin and is capable of preventing or suppressing polishing vibration. The polishing composition provided by the present invention includes abrasive grains, a basic compound, a water-soluble polymer, and water, and furthermore includes an organic acid or a salt thereof.
Inventors:
TANIGUCHI MEGUMI (JP)
MUKAI TAKATOSHI (JP)
MUKAI TAKATOSHI (JP)
Application Number:
PCT/JP2019/042115
Publication Date:
May 22, 2020
Filing Date:
October 28, 2019
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2013108770A1 | 2013-07-25 |
Foreign References:
| JP2017183359A | 2017-10-05 | |||
| JP2014049633A | 2014-03-17 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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