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Patent Searching and Data


Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/255921
Kind Code:
A1
Abstract:
A polishing composition is provided with which a work can be polished with reduced force of friction therewith at a satisfactory polishing rate. The polishing composition provided by the present invention comprises water, abrasive grains, and a composite metal oxide as an oxidizing agent. The polishing composition further contains an anionic polymer. Some preferred embodiments of the polishing composition contain a permanganate as the composite metal oxide. The polishing composition is suitable for use in polishing materials having Vickers hardnesses of 1,500 Hv or higher.

Inventors:
ITO YASUAKI (JP)
TAKAMI SHINICHIRO (JP)
MORI YOSHIO (JP)
Application Number:
PCT/JP2020/023398
Publication Date:
December 24, 2020
Filing Date:
June 15, 2020
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2016158328A12016-10-06
WO2009031389A12009-03-12
WO2017221660A12017-12-28
WO2018128849A12018-07-12
WO2013035539A12013-03-14
Foreign References:
JP2009295747A2009-12-17
JP2017182849A2017-10-05
JP2017183297A2017-10-05
JP2017182858A2017-10-05
JP2006086353A2006-03-30
Attorney, Agent or Firm:
ABE, Makoto (JP)
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