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Patent Searching and Data


Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/065225
Kind Code:
A1
Abstract:
The present invention provides a means which is capable of improving the flatness of the outer peripheral part of a silicon wafer, while maintaining a high polishing rate. The present invention is a polishing composition which is used for the purpose of polishing a silicon wafer, and which contains abrasive grains, a basic compound, a phosphorus-containing compound represented by chemical formula 1, and water. In chemical formula 1, each of R1 and R2 independently represents a hydrogen atom, a hydroxy group or an unsubstituted linear or branched alkoxy group having from 1 to 20 carbon atoms; and R3 represents an unsubstituted linear or branched alkoxy group having from 1 to 20 carbon atoms.

Inventors:
TANABE, Yoshiyuki (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, JP)
TANIGUCHI, Megumi (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, JP)
Application Number:
JP2020/031090
Publication Date:
April 08, 2021
Filing Date:
August 18, 2020
Export Citation:
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Assignee:
FUJIMI INCORPORATED (Nishibiwajima-cho Kiyosu-sh, Aichi 02, JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Attorney, Agent or Firm:
HATTA & ASSOCIATES (11-9 Nibancho, Chiyoda-k, Tokyo 84, JP)
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