Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/199723
Kind Code:
A1
Abstract:
A polishing composition is provided with which it is possible to obtain polished substrates having improved surface quality. The polishing composition comprises abrasive grains, a water-soluble polymer, a basic compound, and water. The polishing composition further contains a polyoxyalkylene alkyl ether in which a secondary carbon atom of the alkyl group has been bonded to the polyoxyalkylene by an ether linkage.
Inventors:
GOTO OSAMU (JP)
ASADA MAKI (JP)
TAKAMA DAIKI (JP)
TSUCHIYA KOHSUKE (JP)
ASADA MAKI (JP)
TAKAMA DAIKI (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2021/005409
Publication Date:
October 07, 2021
Filing Date:
February 15, 2021
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09G1/02; B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
| WO2018124226A1 | 2018-07-05 | |||
| WO2020013332A1 | 2020-01-16 |
Foreign References:
| JP2006160964A | 2006-06-22 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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