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Patent Searching and Data


Title:
POLISHING DEVICE FOR COLUMNAR MEMBER AND POLISHING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2012/029194
Kind Code:
A1
Abstract:
Provided are an inexpensive polishing device having high polishing capability for removing minute cracks present in a columnar surface layer portion produced from a hard and brittle material and fine polishing capability for removing asperities on the surface to obtain finer surface roughness, and an polishing method therefor. A polishing device for a columnar member is provided with: a clamping means coupled to a rotating means for an object to be processed to clamp both end surfaces of the object to be processed; a polishing means for performing polishing processing with the edge of a polishing tool thereof rotating in contact with a processing surface; a moving means for relatively moving the polishing means in the longitudinal direction orthogonal to the cross-sectional direction of the object to be processed with respect to the object to be processed; a height position detecting means for storing the height position of the processing surface of the object to be processed, the height position being detected before the polishing processing; and a control means for performing the polishing processing by subjecting the height position stored by the position detecting means and the amount of cutting by the edge of the polishing means to arithmetic processing.

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Inventors:
TANAHASHI SHIGERU (JP)
NODA YASUO (JP)
Application Number:
PCT/JP2010/067915
Publication Date:
March 08, 2012
Filing Date:
October 13, 2010
Export Citation:
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Assignee:
SINTOKOGIO LTD (JP)
TANAHASHI SHIGERU (JP)
NODA YASUO (JP)
International Classes:
B24B5/04; B24B5/37; B24B5/50; H01L21/304
Foreign References:
JPH05192853A1993-08-03
JP2002292559A2002-10-08
JP2003117800A2003-04-23
JP2000084848A2000-03-28
JPH11114800A1999-04-27
JPH0392261A1991-04-17
Attorney, Agent or Firm:
YAMASAKI, Yukuzo et al. (JP)
Yukuzo Yamazaki (JP)
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Claims: