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Title:
POLISHING DEVICE FOR CYLINDRICAL MEMBERS, CYLINDRICAL MEMBERS, AND POLISHING METHOD FOR CYLINDRICAL MEMBERS
Document Type and Number:
WIPO Patent Application WO/2012/066689
Kind Code:
A1
Abstract:
Provided are a polishing device and a polishing method for the polishing device, whereby workpieces comprising a hard and brittle material are machined into a cylindrical shape with a prescribed diameter, microcracks present on the surface layer of the workpieces are removed, and surface roughness is refined by removing surface irregularities. The polishing device is provided with: a clamping means that is connected to a workpiece rotation means, and that clamps both ends of the workpiece; a polishing means, the tip of which comes into contact with the outer surface of the workpiece and rotates, thereby polishing the outer surface of the workpiece; a moving means that moves the workpiece relative to the polishing means in a cylindrical-shaped axial direction of the workpiece; a height position detection means that detects the height position of a polished finished product and a workpiece to be polished; and a control means that carries out polishing by calculating the height positions and machining conditions that have been inputted. The polishing means is provided with at least one grindstone, and a polishing brush provided with a bristle material or an elastic body containing abrasive grains. The grindstone and polishing brush are positioned so as to be provided continuously along the axis of a cylindrical workpiece.

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Inventors:
SAWAI SHOUTA (JP)
TANAHASHI SHIGERU (JP)
HIRANO MASAO (JP)
Application Number:
PCT/JP2010/072090
Publication Date:
May 24, 2012
Filing Date:
December 09, 2010
Export Citation:
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Assignee:
SINTOKOGIO LTD (JP)
SAWAI SHOUTA (JP)
TANAHASHI SHIGERU (JP)
HIRANO MASAO (JP)
International Classes:
B24B5/04; B24B5/50; B24B29/00; B24B29/04
Foreign References:
JPH0636760U1994-05-17
JP2000094321A2000-04-04
JP2000127005A2000-05-09
JPH0435865U1992-03-25
JP2003094304A2003-04-03
Attorney, Agent or Firm:
YAMASAKI, Yukuzo et al. (JP)
Yukuzo Yamazaki (JP)
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Claims: