Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING DEVICE, INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/065516
Kind Code:
A1
Abstract:
The present invention has: a polishing table that is configured so as to be capable of rotating and that has an eddy current sensor provided thereto; a polishing head that faces the polishing table, is configured so as to be capable of rotating, and is such that a substrate can be attached to the surface facing the polishing table; and a processor that executes predetermined preprocessing on output signals from when the eddy current sensor is located at positions facing a target substrate to generate preprocessed data of the target substrate during a process for polishing the target substrate, inputs data after the predetermined preprocessing has been executed on the output signals from when the eddy current sensor is located at positions facing the target substrate, and inputs the preprocessed data of the target substrate to a learned machine-learning model using a learning dataset for which the wiring height of the substrate in at least one position serves as an output, thereby determining the wiring height of the target substrate in at least one position.

Inventors:
NAKAMURA AKIRA (JP)
Application Number:
JP2020/035106
Publication Date:
April 08, 2021
Filing Date:
September 16, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/013; B23Q15/12; B24B37/30; B24B49/04; B24B49/10; G05B19/404; G05B19/4155; H01L21/304
Attorney, Agent or Firm:
OHNO Seiji et al. (Marunouchi Kitaguchi Building 21F 6-5, Marunouchi 1-chome, Chiyoda-k, Tokyo 05, JP)
Download PDF: