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Patent Searching and Data


Title:
POLISHING DEVICE, POLISHING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/044694
Kind Code:
A1
Abstract:
The present invention relates to a polishing device and a polishing method for polishing the back side of a substrate such as a wafer. The present invention further relates to a substrate processing device provided with the polishing device. This polishing device is provided with a substrate holding unit (10) which holds a substrate (W) in a state with the device surface (2) thereof facing upwards and which rotates the substrate (W); a polishing tool (31) which contacts a non-device surface (1) of the substrate (W) and polishes the non-device surface (1) of said substrate (W); and a contactless washing mechanism (30) which washes the device surface (2) of the substrate (W) while the non-device surface (1) of the substrate (W) is processed with the polishing tool (31).

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Inventors:
NAKANISHI MASAYUKI (JP)
Application Number:
PCT/JP2020/023328
Publication Date:
March 11, 2021
Filing Date:
June 15, 2020
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B55/08; B24B21/00; H01L21/304
Foreign References:
JP2015119161A2015-06-25
JP2017108113A2017-06-15
JP2006303143A2006-11-02
JP2004273961A2004-09-30
JP2019091886A2019-06-13
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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