Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/043796
Kind Code:
A1
Abstract:
The present invention pertains to a polishing device that uses a polishing tool to polish an edge part of a wafer. The polishing device is provided with a substrate holding part (1) that holds and rotates a substrate (W), and at least one polishing unit that uses a belt-like polishing tool (5) to polish an edge part of the substrate (W). The polishing unit is provided with: a disk head (12) having an outer circumferential surface that supports the rear surface of the polishing tool (5); a pressing band (14) that presses the polishing tool (5) against the outer circumferential surface of the disk head (12); and a plurality of band guide rollers (15A to 15D) that support the pressing band (14).

Inventors:
KASHIWAGI MAKOTO (JP)
HOSHINA MANAO (JP)
Application Number:
PCT/JP2017/030992
Publication Date:
March 07, 2019
Filing Date:
August 29, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/12; B24B9/00; B24B21/00; H01L21/304
Foreign References:
JP2015150662A2015-08-24
JP2012213849A2012-11-08
JP2003117795A2003-04-23
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
Download PDF: