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Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/112034
Kind Code:
A1
Abstract:
The present invention pertains to a polishing device and a polishing method for polishing, on a polishing pad, a workpiece such as a wafer on which a pattern has been formed. In particular, the present invention to a polishing device and a polishing method for detecting geometric elements of the pattern such as pitch. A polishing device is provided with: a polishing table (3) for supporting a polishing pad (2); a polishing head (1) for pressing a workpiece (W) on which a pattern has been formed against the polishing pad (2) to polish the surface of the workpiece (W); an imaging device (20) that is disposed inside the polishing table (3) and generates an image including at least the pattern of the workpiece (W); and an image analysis system (30) for determining geometric elements of the pattern of the workpiece (W) on the basis of the image.

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Inventors:
MATSUO HISANORI (JP)
SUZUKI KEISUKE (JP)
Application Number:
PCT/JP2020/044497
Publication Date:
June 10, 2021
Filing Date:
November 30, 2020
Export Citation:
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Assignee:
EBARA CORP (JP)
KYUSHU INST TECH (JP)
International Classes:
B24B37/005; B24B49/12; H01L21/304
Foreign References:
JP2013240846A2013-12-05
JP2002289563A2002-10-04
JP2011211093A2011-10-20
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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