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Patent Searching and Data


Title:
POLISHING DEVICE PROVIDED WITH POLISHING PAD SURFACE PROPERTY MEASURING DEVICE, AND POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/208712
Kind Code:
A1
Abstract:
The present invention relates to a polishing device provided with a surface property measuring device for measuring a surface property of a polishing pad used to polish a substrate such as a semiconductor wafer, and a polishing system including such a polishing device. The polishing device is provided with a surface property measuring device (30) for measuring a surface property of a polishing pad (2), a support arm (50) for supporting the surface property measuring device (30), and a movement unit (53) which is linked to the support arm (50) to automatically move the surface property measuring device (30) from a retracted position to a measuring position.

Inventors:
KAMIKI KEISUKE (JP)
MARUYAMA TORU (JP)
MOTOSHIMA YASUYUKI (JP)
Application Number:
PCT/JP2019/017691
Publication Date:
October 31, 2019
Filing Date:
April 25, 2019
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B49/02; B24B49/12; B24B53/017; H01L21/304
Foreign References:
JPH10315131A1998-12-02
JPH10296615A1998-11-10
JP2006263876A2006-10-05
JPH05312526A1993-11-22
JPH10197219A1998-07-31
JP2001198794A2001-07-24
JP2016209951A2016-12-15
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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