Title:
POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/176413
Kind Code:
A1
Abstract:
The present invention relates to a polishing device in which a polishing tape is pressed against an edge portion of a substrate to polish the edge portion. The polishing device comprises a substrate holding portion (1) that holds and rotates a substrate W, a pressing member (11) that presses the polishing surface of a polishing tape (7) against the edge portion of the substrate W, and a pressing roller mechanism (50) disposed on the polishing surface side of the polishing tape (7). The pressure roller mechanism (50) includes at least one pressure roller unit (51) having a pressure roller (52) in contact with the polishing surface of the polishing tape (7), a biasing means (54) for applying, to the pressing roller (11), a biasing force for pressing the surface of the polishing tape (7) on the side opposite to the polishing surface against the pressing member (11), and a biasing force adjustment mechanism (53) that adjusts the biasing force of the biasing means (54).
Inventors:
DU FONG-JIE (JP)
KASHIWAGI MAKOTO (JP)
YOSHIDA ATSUSHI (JP)
YAMASHITA MICHIYOSHI (JP)
KASHIWAGI MAKOTO (JP)
YOSHIDA ATSUSHI (JP)
YAMASHITA MICHIYOSHI (JP)
Application Number:
PCT/JP2019/004867
Publication Date:
September 19, 2019
Filing Date:
February 12, 2019
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/00; B24B9/00; B24B21/20; H01L21/304
Foreign References:
| JP2018015841A | 2018-02-01 | |||
| JPH11856A | 1999-01-06 | |||
| JPS62110850U | 1987-07-15 | |||
| JPS5622211A | 1981-03-02 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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