Title:
POLISHING FLUID AND CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/255581
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polishing fluid which, when applied to chemical mechanical polishing (CMP) of a work having a cobalt-containing film, is less apt to make the polished surface of said work have erosion or scratches therein. The present invention also addresses the problem of providing a method of CMP with the polishing fluid. This polishing fluid is for use in CMP of a work having a cobalt-containing film, and comprises colloidal silica, an organic acid, a specific nitrogenous aromatic heterocyclic compound, and hydrogen peroxide and has a pH of 8.5-12.
Inventors:
KAMIMURA TETSUYA (JP)
Application Number:
PCT/JP2020/018765
Publication Date:
December 24, 2020
Filing Date:
May 11, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2015129342A1 | 2015-09-03 | |||
| WO2018159530A1 | 2018-09-07 | |||
| WO2018217628A1 | 2018-11-29 |
Foreign References:
| JP2004273650A | 2004-09-30 | |||
| JP2018107294A | 2018-07-05 | |||
| JP2018157164A | 2018-10-04 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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