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Patent Searching and Data


Title:
POLISHING HEAD, WAFER POLISHING DEVICE USING SAME, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/220712
Kind Code:
A1
Abstract:
[Problem] To suppress fluctuations in polishing pressure at an outer circumferential section of a wafer, and increase flatness. [Solution] A polishing head 10 of a wafer polishing device is provided with: a membrane head 16 that can independently control a center section control pressure Pc pressing a center section of a wafer W, and an outer circumferential section control pressure Pe pressing an outer circumferential section of the wafer W; an outer ring 17 integrated with the membrane head 16 so as to configure the outer circumferential section of the membrane head 16; and a grounding type retainer ring 14 provided at an outer side of the membrane head 16. The membrane head 16 has a center section pressure chamber R1 of a single chamber structure that controls the center section control pressure Pc, and an outer circumferential section pressure chamber R2 that is provided above the center section pressure chamber R1, and that controls the outer circumferential section control pressure Pe. The position of a lower end of the outer ring 17 reaches at least a position of an inside bottom surface S1 of the center section pressure chamber R1, and the position of an upper end of the outer ring 17 reaches at least a position of an inside upper surface S2 of the center section pressure chamber R1.

Inventors:
NAKANO YUKI (JP)
SUGIMORI KATSUHISA (JP)
KOZASA KAZUAKI (JP)
KAJIWARA JIRO (JP)
YAMAMOTO KATSUTOSHI (JP)
KIHARA TAKAYUKI (JP)
TERAKAWA RYOYA (JP)
Application Number:
PCT/JP2019/004972
Publication Date:
November 21, 2019
Filing Date:
February 13, 2019
Export Citation:
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Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B37/30; B24B37/32
Foreign References:
US20040005842A12004-01-08
US20170106496A12017-04-20
KR101293485B12013-08-06
JP2003175455A2003-06-24
US9321144B22016-04-26
US20090023368A12009-01-22
US20130316628A12013-11-28
JP2015536575A2015-12-21
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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