Title:
POLISHING HEAD AND WAFER POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/193877
Kind Code:
A1
Abstract:
This polishing head comprises at least: an annular ceramic ring; a template which is adhered to the ceramic ring and in which a backing pad and a guide ring are integrated; and a backplate which is joined to the ceramic ring, and which forms a space together with the backing pad and the ceramic ring. The polishing head retains the back surface of a wafer on a bottom surface part of the backing pad, and polishes the top surface of the wafer by slidingly contacting the top surface to a polishing cloth that is adhered to a surface plate. The polishing head is characterized in that a non-compressive fluid is sealed in the space, and the viscosity of the non-compressive fluid is 10 to 1,200 mPa∙s. Due to this configuration, a polishing head and a polishing method are provided with which deformation of the backing pad occurring in a slight gap that is formed between the template and the wafer can be reduced, and the uniformity of polishing at the outermost peripheral section of the wafer can be improved.
Inventors:
UENO JUNICHI (JP)
ISHII KAORU (JP)
ISHII KAORU (JP)
Application Number:
PCT/JP2019/007421
Publication Date:
October 10, 2019
Filing Date:
February 27, 2019
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/30; H01L21/304
Foreign References:
| JPH08339979A | 1996-12-24 | |||
| JP2008110407A | 2008-05-15 | |||
| US20140120804A1 | 2014-05-01 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
Download PDF:
Previous Patent: DRIVE CIRCUIT, DRIVE METHOD, AND SEMICONDUCTOR SYSTEM
Next Patent: PATHOGEN DETECTION DEVICE AND PATHOGEN DETECTION METHOD
Next Patent: PATHOGEN DETECTION DEVICE AND PATHOGEN DETECTION METHOD