Title:
POLISHING LIQUID COMPOSITION FOR SILICON OXIDE FILM
Document Type and Number:
WIPO Patent Application WO/2022/113775
Kind Code:
A1
Abstract:
A polishing liquid composition for silicon oxide films which is capable of having improved polishing selectivity in polishing silicon oxide films is provided in one aspect. This polishing liquid composition for silicon oxide films comprises cerium oxide particles (component A), a water-soluble anionic condensate (component B), and an aqueous medium, wherein the component B is a product of co-condensation of monomers comprising a monomer (constituent monomer b1) represented by formula (I) and a monomer (constituent monomer b2) represented by formula (II), the molar proportion (%) of the constituent monomer b1 to the sum of the constituent monomer b1 and constituent monomer b2 in the component B exceeding 30%.
Inventors:
SUGAHARA MASATO
YAMAGUCHI NORIHITO
YAMAGUCHI NORIHITO
Application Number:
PCT/JP2021/041685
Publication Date:
June 02, 2022
Filing Date:
November 12, 2021
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
C09G1/02; B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
| WO1999043761A1 | 1999-09-02 |
Foreign References:
| JP2012503880A | 2012-02-09 | |||
| JP2006179678A | 2006-07-06 | |||
| JP2019087660A | 2019-06-06 | |||
| JP2019116520A | 2019-07-18 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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