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Patent Searching and Data


Title:
POLISHING LIQUID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/003959
Kind Code:
A1
Abstract:
An aspect of the present invention provides a polishing liquid composition capable of enhancing polishing speed and reducing short-wavelength undulation after polishing. An aspect of the present invention relates to a polishing liquid composition for rough polishing of a Ni-P-plated aluminum alloy substrate, the composition containing non-spherical silica particles, a water-soluble polymer, and an aqueous medium, wherein the surface tension of a 1 mass% aqueous solution of the water-soluble polymer at 25ºC and pH 1.5 is 52-71 mN/m.

Inventors:
MIURA JOJI
Application Number:
PCT/JP2018/022874
Publication Date:
January 03, 2019
Filing Date:
June 15, 2018
Export Citation:
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Assignee:
KAO CORP (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; G11B5/84
Foreign References:
JP2016084428A2016-05-19
JP2001011433A2001-01-16
JP2017111840A2017-06-22
JP2016027517A2016-02-18
JP2017102990A2017-06-08
Attorney, Agent or Firm:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS (JP)
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