Title:
POLISHING LIQUID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/075413
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a polishing liquid composition which is capable of reducing scratches and waves in a substrate surface after polishing, while ensuring an adequate polishing rate. One embodiment of the present disclosure relates to a polishing liquid composition which contains silica particles (component A), a compound (component B), an acid (component C) and an aqueous medium, wherein: the component B is a compound represented by formula (I) or formula (2); and the pH is 3 or less.
Inventors:
KURATA SHUYA
TAKUSHIMA DAIKI
TAKUSHIMA DAIKI
Application Number:
PCT/JP2021/037168
Publication Date:
April 14, 2022
Filing Date:
October 07, 2021
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; G11B5/84
Domestic Patent References:
| WO2017169808A1 | 2017-10-05 | |||
| WO2013137220A1 | 2013-09-19 | |||
| WO2018159530A1 | 2018-09-07 |
Foreign References:
| JP2019167404A | 2019-10-03 | |||
| JP2012028516A | 2012-02-09 | |||
| JP2003193037A | 2003-07-09 | |||
| JP2009131947A | 2009-06-18 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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