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Title:
POLISHING LIQUID, CONCENTRATE OF SAME, METHOD FOR PRODUCING POLISHED ARTICLE USING POLISHING LIQUID, AND POLISHING METHOD OF SUBSTRATE USING POLISHING LIQUID
Document Type and Number:
WIPO Patent Application WO/2020/066998
Kind Code:
A1
Abstract:
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The average particle diameter D50 of the ceria abrasive grains is from 120 nm to 550 nm (inclusive). The average particle diameter D50 of the silica abrasive grains is from 40 nm to 140 nm (inclusive). The mass ratio of the silica abrasive grains to the ceria abrasive grains in the polishing liquid, namely the value of (silica abrasive grains)/(ceria abrasive grains) is from 4/100 to 150/100 (inclusive). The content of the ceria abrasive grains in the polishing liquid is from 0.25% by mass to 2.5% by mass (inclusive). The content of the silica abrasive grains in the polishing liquid is from 0.1% by mass to 1.5% by mass (inclusive).

Inventors:
HOSOI DAISUKE (JP)
KUBOTA NAOKI (JP)
SHIGETA TAKASHI (JP)
INOUE YUKI (JP)
SUZUKI TAKAMASA (JP)
Application Number:
PCT/JP2019/037239
Publication Date:
April 02, 2020
Filing Date:
September 24, 2019
Export Citation:
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Assignee:
BAIKOWSKI JAPAN CO LTD (JP)
DISCO CORP (JP)
International Classes:
C09K3/14; B24B37/00; C03C19/00; C09G1/02
Domestic Patent References:
WO2012165376A12012-12-06
Foreign References:
JP2006096977A2006-04-13
JP2016127139A2016-07-11
JP2000336344A2000-12-05
JP2002150548A2002-05-24
JP2004331852A2004-11-25
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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