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Title:
POLISHING LIQUID AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/240235
Kind Code:
A1
Abstract:
This polishing liquid, for polishing a cobalt-containing surface to be polished, contains: abrasive grains; at least one type of sugar component selected from a group consisting of sugar alcohols, sugar alcohol derivatives and polysaccharides; an acid component; and water, wherein the pH of the polishing liquid exceeds 8.0.

Inventors:
KONDO SHUNSUKE (JP)
OTSUKA YUYA (JP)
OOUCHI MAYUMI (JP)
INOUE KEISUKE (JP)
Application Number:
PCT/JP2019/023564
Publication Date:
December 19, 2019
Filing Date:
June 13, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
WO2015129342A12015-09-03
WO2016143797A12016-09-15
Foreign References:
JP2016178294A2016-10-06
JP2011003665A2011-01-06
JP2016020294A2016-02-04
JP2014229827A2014-12-08
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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