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Patent Searching and Data


Title:
POLISHING LIQUID AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/170331
Kind Code:
A1
Abstract:
One aspect of the present invention is a polishing liquid containing abrasive grains, a copolymer, and a liquid medium, wherein the copolymer has a structural unit derived from at least one styrene compound selected from the group consisting of styrene and styrene derivatives and a structural unit derived from acrylic acid; the content of copolymer is from more than 0.01 mass% to 0.2 mass% based on the total weight of the polishing liquid; and the pH of the polishing liquid exceeds 4.5.

Inventors:
FUJIMATSU AI (JP)
KANAMARU MAMIKO (JP)
YAMAMURA NAO (JP)
Application Number:
PCT/JP2019/006082
Publication Date:
August 27, 2020
Filing Date:
February 19, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2009031389A12009-03-12
Foreign References:
KR20180073131A2018-07-02
KR20160080555A2016-07-08
CN103898512A2014-07-02
CN103898511A2014-07-02
CN103898510A2014-07-02
JP2016222867A2016-12-28
JP5177430B22013-04-03
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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