Title:
POLISHING METHOD, POLISHING DEVICE, AND COMPUTER-READABLE RECORDING MEDIUM RECORDING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/181944
Kind Code:
A1
Abstract:
The present invention relates to a polishing method and a polishing device for polishing a substrate such as a wafer. Moreover, the present invention relates to a computer-readable recording medium recording a program for causing the polishing device to carry out the polishing method. This method involves rotating a polishing table (3) and pressing a substrate (W) against a polishing surface (2a) to polish the substrate (W). Steps for polishing the substrate (W) comprise: a film thickness profile adjustment step and a polishing end point detection step. The film thickness profile adjustment step comprises a step for adjusting a pressing force of the substrate (W) against the polishing surface (2a) on the basis of a plurality of film thicknesses and determining a time when a film thickness index value determined from at least one of the plurality of film thicknesses reaches a film thickness threshold value. The polishing end point detection step comprises a step for measuring a torque for rotating the polishing table (3) and determining a polishing end point on the basis of the torque.
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Inventors:
ITO BAN (JP)
IIZUMI TAKESHI (JP)
ROYERE GAEL (JP)
ONG PATRICK (BE)
VANDERSMISSEN KEVIN (BE)
DEVRIENDT KATIA (BE)
IIZUMI TAKESHI (JP)
ROYERE GAEL (JP)
ONG PATRICK (BE)
VANDERSMISSEN KEVIN (BE)
DEVRIENDT KATIA (BE)
Application Number:
PCT/JP2021/003691
Publication Date:
September 16, 2021
Filing Date:
February 02, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/005; B24B37/013; B24B49/04; B24B49/12; B24B49/16; H01L21/304
Foreign References:
| JP2013219248A | 2013-10-24 | |||
| JP2012138442A | 2012-07-19 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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